PCD Micro Drill

 

Applications

• Micro Hole Drilling
• High aspect ratio of micro hole drilling
• Diameter of less than 1mm
• Si Electrode small hole drilling

 

 

Silicon Electrode Micro Hole

 

Plasma is uniformly distributed on the wafer surface by sending gas between the micro holes of the electrode. The electrode is installed in the etching process equipment. 

 

 

Semiconductor Etching Process

 

 

The etching process results in the desired pattern by removing the lower film after the photo process. 

 

 

 

 

Features

• Designed to fit into drill for machining of brittle materials such as Si(Silicon)
• Drill Geometries with multi-point angle and web thining
• High Edge Sharpness
• Long Tool Life
• Excellent Surface Finish
• Respond to different Drill dimensions

 

 

Model	D	d	L	L1	L2
D035L07	0.35	3.175	38.1	6.8	7.0
D042L07	0.42	3.175	38.1	6.8	7.0
D042L12	0.42	3.175	38.1	11.7	12.0
D045L07	0.45	3.175	38.1	6.8	7.0
D072L14	0.72	3.175	38.5	14.0	14.2
D072L20	0.72	3.175	38.5	19.7	20.0
D075L14	0.75	3.175	38.5	14.0	14.2

 

 

 

 

 

Test

Tested using Saehan Nanotech's drilling machine(Both-Sided Spindle Drilling Machine, BSSD500), little chipping was observed in the drill after processing, and the size and shape of the holes were consistent.

Drill shape after process

Hole shape after process

 

 

 

 

The tool was developed jointly with a drilling equipment manufacturer and an electrode micro-hole processing company. If you are interested in our tools, including test results, please contact us using the contact information below.

 

info@saehannanotech.com